Multilayer PCB buried and blind via Halogen Free VIPPO IST test| YSPCB
What is Multilayer PCBs
Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB. It features layers more than double sided PCB.
Benefits of Multilayer PCBs (compared to single or double-sided PCBs)
Higher assembly density
Smaller size (considerable savings on space)
Increased flexibility
Easier incorporation controlled impedance features.
EMI shielding through careful placement of power and ground layers.
Reduces the need for interconnection wiring harnesses (reduces overall weight)
Building a Multilayer PCB
Multilayer PCBs are built by joining all the number of layers and materials at high temperature and pressure so as to remove any trapped air between the layers. Resin and adhesive material is used to stick the components and different layers together. You can choose from a number of materials such as exotic ceramic, epoxy glass, or Teflon etc. to build your PCB. The different prepreg and core layers are combined and go through the lamination process taking place at high temperature and pressure that helps to melt the layers together. After that the PCB is cooled down to form a hard and solid board.
Multi-Layer or Multilayer Printed Circuit Boards (PCBs), or Multilayer Boards (MLBs), which have more than 2 copper layers. A multilayer PCB must have a minimum of 3 conductive layers of conductive material or copper layer. All the layers are interconnected with copper plated holes, including NC vias and laser microvias either in plated through, or in buried and blind. The advantage of the multi-layer PCB circuit board is that the lines can be distributed in multiple layers to be designed more precisely. Or smaller products can be realized by multilayer boards, such as mobile phone circuit boards, micro projectors, voice recorders, and other products with relatively large volumes. Besides, multi-layer can increase the flexibility of design, better control the differential impedance and single-ended impedance, and some signal frequency better output.
Multilayer printed circuit boards are widely used to manufacture electronic products due to their flexible design, stable and reliable electrical performance, and excellent economic performance. Especially with the extensive and in-depth application of large-scale integrated circuits, multilayer PCBs are developing in the direction of high density, high precision, and high-level digitization. Fine lines, slight aperture penetration, and blind hole technologies (such as buried via and high plate thickness to aperture ratio) can meet market needs.
Structure of Multilayer PCB Boards
Dielectric: Used to maintain the insulation between the circuit and each layer, commonly known as the substrate.
Through-hole / via Vias can make the lines of more than two layers connect, larger vias are used to insert components, and there are non-plating through-hole (NPTH) is used for surface mount positioning and fixing screws during assembly.
Solder resistant /Solder Mask: According to different processes, it is divided into green oil, red oil, and blue oil.
Legend /Marking/Silkscreen: This is a non-essential structure. The primary function is to mark each part’s name and position frame on the circuit board to facilitate maintenance and identification after assembly.
Surface Finish: Since the copper surface is easily oxidized in the general environment, resulting in poor solderability, it is necessary to protect the copper surface. The protection methods are HASL, ENIG, Immersion Gold, Immersion Silver, Immersion Tin, OSP. Each has its advantages and disadvantages, collectively referred to as surface treatment.
YS Multilayer PCB manufacturing capabilities:
| YS Multilayer PCB manufacturing capabilities overview | ||
| Feature | capabilities | |
| Layer Count | 3-60L | |
| Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 | |
| buried and blind via | ||
| Hybrid | High Frequency Material such as RO4350B and FR4 Mix etc. | |
| High Speed Material such as M7NE and FR4 Mix etc. | ||
| Thickness | 0.3mm-8mm | |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
| BGA PITCH | 0.35mm | |
| Min mechanical Drilled Size | 0.15mm(6mil) | |
| Aspect Ratio for through hole | 16:1 | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP,ENEPIG.etc. | |
| Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
| Copper filled, silver filled | ||
| Registration | ±4mil | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
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