High-density interconnect (HDI) PCB due to its higher circuit density, HDI PCB designs can include finer lines and Spaces, smaller through holes and capture pads, and higher connection pad density.High-density PCBS have blind and buried holes and usually contain micropores with a diameter of 0.006 or smaller.
1.Multi-step HDI can realize the connection between any layer;
2. Cross-layer laser processing can improve the quality level of multi-step HDI;
3. The combination of HDI and high frequency materials, metal base laminates, FPC and other special laminates and processes can meet the requirements of high density and high frequency, high thermal conductivity or 3D assembly.