Micro via PCB HDI PCB 8L 1+N+1 Via on PAD| YSPCB

Short Description:

HDI printed circuit boards offer the finest trace structures, the smallest holes and Blind & Buried Vias (Microvias). HDI technology enables a highly compact, reliable printed circuit board design. Also applied are Via-in-Pad and multiple microvia-layers (Stacked & Staggered Vias).

Parameters

Layers: 8

Base Material:FR4 High Tg IT180A

Thickness：1.6±0.10mm

Min.Hole Size：0.15mm

Minimum Line Width/Space：0.10mm/0.10mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：225mm×168mm

Aspect Ratio：10.6 : 1

Surface treatment：ENIG

Speciality: Laser via copper plated shut,VIPPO Technology,Buried Hole

Applications:Computer

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Product Detail

HDI Board production process:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance. Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On the whole, the production process of HDI plate is complex, which needs to be completed after many times of production for a long time. It’s not only high requirements for the accuracy and shrinkage control of each layer, but also high standards in materials, equipment, environment and technical personnel.

YS HDI PCB manufacturing capabilities:

YS HDI PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	4-60L
Available HDI PCB Technology	1+N+1
	2+N+2
	3+N+3
	4+N+4
	5+N+5
	Any layer
Thickness	0.3mm-6mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.