HDI pcb any layer hdi pcb high speed insertion loss test enepig| YSPCB

Short Description:

HDI any-layer printed circuit boards,sometimes also called an ELIC – Every Layer Interconnect HDI, is a PCB where each layer is a microvia-based HDI layer, and all the connections between the layers are made using copper filled microvias.

Parameters

Layers: 12L HDI any-layer pcb

Board Thinkness:1.6mm

Base Material:M7NE

Min Holes:0.2mm

Minimum Line Width/Clearance：0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：107.61mm×123.45mm

Aspect Ratio：10 : 1

Surface treatment：ENEPIG+ Gold Finger

Speciality: Any layer hdi pcb, high speed material, hard gold plating for edge connectors,insertion loss test, Z-axis milling,Laser via copper plated shut

Special Process：Thickness of Gold finger:12“

Differential impedance 100+7/-8Ω

Applications:Optical module

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Product Detail

What is HDI PCB

HDI PCB: High density interconnect PCB, are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

YS HDI PCB manufacturing capabilities:

YS HDI PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	4-60L
Available HDI PCB Technology	1+N+1
	2+N+2
	3+N+3
	4+N+4
	5+N+5
	Any layer
Thickness	0.3mm-6mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min laser Drilled Size	0.075mm(3nil)
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for laser hole	0.9:1
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over
	Copper filled, silver filled
	Laser via copper plated shut
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.