Multilayer pcb Sideplating Selective hard gold Castellated Holes| YSPCB
What is Multilayer PCBs
Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB. It features layers more than double sided PCB.
PCB with special requirements from industries
PCB Sideplating
Sideplating is the metalization of the board edge in the PCB filed. Edge plating, Border plated, plated contour, side metal, these words can also be used to describe the same function.
Half-cut Castellated Holes
Castellations are plated through holes or vias located in the edges of a printed circuit board. are indentations created in the form of semi-plated holes on the edges of the PCB boards.These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.
Parameters
Layers: 10L multilayer pcb
Board Thinkness:2.0mm
Base Material:S1000-2 High tg
Min Holes:0.2mm
Minimum Line Width/Clearance：0.25mm/0.25mm
Minimum Clearance between Inner Layer PTH to Line： 0.2mm
Size：250.6mm×180.5mm
Aspect Ratio：10 : 1
Surface treatment：ENIG+ Selective hard gold
Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes
Applications: Wi-Fi modules
YS Multilayer PCB manufacturing capabilities:
| YS Multilayer PCB manufacturing capabilities overview | ||
| Feature | capabilities | |
| Layer Count | 3-60L | |
| Available Multilayer PCB Technology | Through hole with Aspect Ratio 16:1 | |
| buried and blind via | ||
| Hybrid | High Frequency Material such as RO4350B and FR4 Mix etc. | |
| High Speed Material such as M7NE and FR4 Mix etc. | ||
| Thickness | 0.3mm-8mm | |
| Minimum line Width and Space | 0.05mm/0.05mm(2mil/2mil) | |
| BGA PITCH | 0.35mm | |
| Min mechanical Drilled Size | 0.15mm(6mil) | |
| Aspect Ratio for through hole | 16:1 | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Via Fill Option | The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO) | |
| Copper filled, silver filled | ||
| Registration | ±4mil | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
