Flex Printed Circuit Board 1Layer | YSPCB

Characteristics of FPC

1. Free bending, folding and winding, free movement and expansion in 3D space.

2. Good heat dissipation performance, using FPC to reduce the volume.

3. Realize lightweight miniaturization and thinness, so as to achieve the integration of component device and wire connection.

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Flex PCB Board 1Layer

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