Multilayer pcb Sideplating Selective hard gold Castellated Holes| YSPCB

Short Description:

YSPCB makes two types of Printed Circuit Boards (PCBs), one with non-metalized edges and the other with metallized edges. Earlier there was not much demand for metal-edged PCBs, but now more customers are demanding it. There is greater attention for higher quality of PCB metal edging as it enhances the functioning of several products that use these PCBs. The industry has many names for a PCB with metallized edges. Some of these names are side plating, plated contour, border plating, edge plating, castellation, etc.

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Product Detail

What is Multilayer PCBs

Multilayer Printed Circuit Board, It is a type of PCB which comes with a combination of single sided PCB and double sided PCB. It features layers more than double sided PCB.

PCB with special requirements from industries

PCB Sideplating

Sideplating is the metalization of the board edge in the PCB filed. Edge plating, Border plated, plated contour, side metal, these words can also be used to describe the same function.

Half-cut Castellated Holes

Castellations are plated through holes or vias located in the edges of a printed circuit board. are indentations created in the form of semi-plated holes on the edges of the PCB boards.These half holes serve as pads intended to create a link between the module board and the board that it will be soldered onto.

Parameters

Layers: 10L multilayer pcb

Board Thinkness:2.0mm

Base Material:S1000-2 High tg

Min Holes:0.2mm

Minimum Line Width/Clearance：0.25mm/0.25mm

Minimum Clearance between Inner Layer PTH to Line： 0.2mm

Size：250.6mm×180.5mm

Aspect Ratio：10 : 1

Surface treatment：ENIG+ Selective hard gold

Process characteristics: High tg, Sideplating, Selective hard gold, Half-cut Castellated Holes

Applications: Wi-Fi modules

YS Multilayer PCB manufacturing capabilities:

YS Multilayer PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.

What is hard gold in PCB?

The Hard Gold surface finish, also known as Hard Electrolytic Gold, is composed of a layer of gold with added hardeners for increased durability, plated over a barrier coat of nickel using an electrolytic process.

What is hard gold plating?

Hard gold plating is a gold electrodeposit that has been alloyed with another element to alter the grain structure of the gold to achieve a harder deposit with a more refined grain structure. The most common alloying elements used in hard gold plating are cobalt, nickel or iron.Oct 4, 2017

What is the difference between Enig and hard gold?

ENIG plating is much softer than hard gold plating. Grain sizes are about 60 times larger with ENIG plating, and hardness runs between 20 and 100 HK25. ENIG plating holds up well at only 35 grams of contact force or less, and ENIG plating typically lasts for fewer cycles than hard plating.