PCB bare board 4L Black Soldermask buried Hole PCB manufacturer | YS PCB

Short Description:

As the name suggests, bare boards are printed circuit boards (PCBs) without the functional components, including the circuitry and through-holes. These boards consist of only a substrate, metal coating, and conductive pathway, forming the foundation for the future PCB manufacturer.
Bare boards are designed to be configured, so they can be used to test design, concept, and functionality before more expensive components are assembled. Because of this, bare boards offer a lot of benefits in cost and time savings, early defect detection, time-to-market for a competitive edge.

Parameters

Layers: 4L buried Hole PCB

Thickness:1.6mm

Base Material: EM285 Halogen Free

Mininum Hole Size：0.2mm

Minimum Line Width/Clearance：0.15mm/0.15mm

Size：264mm×250mm

Aspect Ratio：8 : 1

Surface treatment：ENIG

Special technique: buried Hole,Halogen Free Material

Applications:Main Board / Consumer electronics

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Product Detail

Printed Circuit Board Introduction

A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components. The rise in popularity of multilayer PCBs with more than two, and especially with more than four, copper planes was concurrent with the adoption of surface mount technology.

YS Normal PCB manufacturing capabilities:

YS Normal PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	1-60L
Available Normal PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Material	CEM-	CEM-1;CEM-2；CEM-4；CEM-5.etc
	FR4	EM827, 370HR, S1000-2, IT180A, IT158, S1000 / S1155, R1566W, EM285, TU862HF,NP170G etc.
	High Speed	Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 etc.
	High Frequency	Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 etc.
	Others	Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000,PEEK,PTFE,ceramic-based etc.
Thickness	0.3mm-8mm
Max.copper Thickness	10OZ
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16：1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.